Picosecond UV laser cutting machine is suitable for cutting, punching, surface microstructure (bionic structure), marking and grooving of ultra-thin metal materials (copper, gold, silver, aluminum, titanium, nickel, stainless steel, molybdenum, etc.), flexible materials (PET, PI, PP, PVC, electromagnetic film, adhesive film, etc.), graphene, carbon fiber, silicon wafer, ceramics, FPC and Other materials, as well as polymer materials Micromachining of composites. The equipment has a wide range of uses and applicability. It can realize the surface micromachining treatment of various types of materials, customize the depth and width, and realize the functions of surface stripping and etching, engraving, grooving, drilling, cutting and so on.
Product features of picosecond UV laser cutting machine
1. It adopts picosecond UV laser and ultrashort pulse UV cold laser processing, with almost no heat conduction. It is suitable for high-speed cutting, etching, line etching, grooving and drilling of any organic-inorganic materials, with a minimum of 3 μ Edge collapse and heat affected zone of M.
2. CCD visual pre scanning & automatic target grasping and positioning processing, automatic processing of imported drawings, simple and fast operation.
3. Excellent beam quality, good long-term working stability and negligible thermal impact.
4. With higher single pulse energy and higher machining accuracy, it can realize fine machining of almost any solid material.
5. Excellent processing flexibility, capable of fine cutting of any shape, including arc, straight line, oblique line, etc.
6. The independently developed software control system can customize and upgrade various functions according to customer requirements, and configure single head or double head work according to requirements.
Application materials and fields of picosecond UV laser cutting machine
Application materials: various types of ultra-thin metal, non-metallic film, graphene, carbon fiber, silicon wafer, ceramics, FPC, PI, pet, PVC, and other material processing, as well as the micro processing of some polymer materials and conforming materials.
Application fields: University research field, bionic structure, semiconductor electronics, aerospace, automobile, biomedicine, etc.
Technical parameters of picosecond UV laser cutting machine
Laser type: 355nm picosecond UV laser
Processing range: 500 * 400mm (customizable)
Focusing lens: 40 * 40MM / 15 * 15mm (customizable)
Focus spot: 5 μ M (depending on material)
Minimum tangent width: ＜ 10 μ M (depending on material)
Thickness of processed products: ≤ 1.5mm (depending on the material)
Scanning speed of galvanometer: ≤ 4000mm / S
Platform moving speed: 500mm / S
Positioning accuracy of workbench: ± 2 μ m
Table repetition accuracy: ± 1 μ m
Processable file formats: Standard Gerber files, DXF files, PLT files, etc
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